Thermal Grizzly Minus Pad 8 heat sink compound 8 W/m·K 100x100x2mm

Thermal Grizzly Minus Pad 8 is a preformed heat sink compound designed for reliable thermal interface performance. With a thermal conductivity of 8 W/m·K and dimensions of 100 x 100 x 2 mm, the pad is composed of metal oxide and silicone and operates across a wide temperature range from -100 to 250 °C. The material is elastic and flexible to compensate for small surface irregularities and to maintain efficient heat transfer between components while providing electrical insulation.

Advantages

The Minus Pad 8 combines high thermal conductivity with high compressibility, enabling effective heat dissipation even where small gaps or uneven surfaces exist. Its flexible ceramic-silicon based matrix with nano aluminum oxide ensures consistent thermal contact without liquid or paste application. The pad is easy to apply due to its tacky surface that adheres with minimal pressure and is RoHS-compliant and environmentally friendly.

Suitable for

• Heat transfer between heat sinks and electronic components such as power transistors and MOSFETs
• Thermal bridging in LED modules and power supplies
• Gap filling in cooling assemblies for small form-factor PCs and embedded devices
• Applications requiring electrical insulation with thermal conduction

Key specifications

• Thermal conductivity: 8 W/m·K
• Operating temperature range: -100 to 250 °C
• Material composition: metal oxide and silicone with ceramic-silicon matrix and nano aluminum oxide
• Dimensions: 100 x 100 x 2 mm
• Mechanical properties: high compressibility and flexible, elastic surface
• Electrical property: electrically insulating

How to use

Measure and cut the pad to the required shape and size to match the surfaces to be thermally connected. Clean both contact surfaces from dust, grease and residues before applying the pad. Peel off the protective film if present, position the pad between the heat sink and the component, and apply light pressure to ensure full contact; the pad’s tackiness and compressibility will conform to surface irregularities. Avoid excessive stretching of the pad when installing and ensure uniform pressure across the interface.

Usage recommendations

For best thermal results, use the Minus Pad 8 where a solid, non-liquid thermal interface is preferred or where repeated disassembly is expected. Maintain a thin, continuous layer without gaps and avoid exposing the pad to chemicals that may degrade silicone-based materials. Replace the pad if it becomes contaminated, torn, or loses elasticity.