Thermal paste Thermal Grizzly Conductonaut 1 g — liquid metal high thermal conductivity

Thermal Grizzly Conductonaut 1 g is a liquid metal thermal paste formulated for high thermal conductivity applications. Designed for direct use between CPU or GPU integrated heat spreaders and metal cooler bases, this liquid metal improves heat transfer compared with conventional thermal pastes. The product is supplied in a 1 g syringe and is intended for users who require maximum thermal coupling and have experience working with non-insulating thermal interface materials.

Advantages

Conductonaut delivers superior thermal conductivity for demanding cooling setups, enabling lower operating temperatures for CPUs and GPUs when applied correctly. Its liquid metal formula fills micro-gaps at the interface more effectively than typical thermal greases. The 1 g size is suitable for multiple precise applications or single high-performance installations. Note that Conductonaut is electrically conductive and requires careful application to avoid contact with exposed circuitry.

Suitable for

• Direct application between CPU/GPU and metal heat sink or vapor chamber
• High-performance desktop and workstation cooling upgrades
• Overclocking and thermal optimization projects
• Professional repairs where maximum heat transfer is required

Key specifications

• Brand: thermal grizzly
• Product: Thermal Grizzly Conductonaut
• Form: liquid metal
• Net weight: 1 g (syringe)
• Application area: CPU/GPU to metal cooler interfaces
• Electrical properties: electrically conductive (not insulated)
• Category: Grease
• MPN / EAN: 4260711990243

How to use

Before applying, power down the system and disconnect all power sources. Remove the cooler and clean both mating surfaces thoroughly with isopropyl alcohol to remove previous thermal compound, flux, or contaminants. Apply a small, controlled amount of Conductonaut to the center of the CPU/GPU heat spreader or to the cooler contact area and spread thinly if required; a single rice-grain or small dot is typically sufficient for most processors. Reattach the cooler with even mounting pressure to spread the material. After installation, inspect nearby components to ensure no liquid metal contacted exposed pins or PCB traces. Allow for a short stabilization period before full system load testing.

Usage recommendations

Use Conductonaut only on metals compatible with liquid metal (copper, nickel-plated surfaces, or certain metal alloys). Do not use on aluminum surfaces unless a suitable barrier is applied. Because the material is electrically conductive, avoid applying near exposed circuits, pins, or connectors. Wear gloves and handle the syringe carefully to prevent contamination. For less experienced users or applications where electrical insulation is required, consider using a non-conductive thermal paste instead.