Thermal pad thermal grizzly Minus Pad Extreme 2, 100 × 100 × 0.5 mm, high-performance thermal interface material

Thermal Grizzly Minus Pad Extreme 2 is a high-performance thermal interface pad measuring 100 × 100 × 0.5 mm designed to provide consistent thermal conduction between electronic components and heatsinks. As a solid yet conformable gap-filling material, it serves as an alternative to paste in applications where ease of installation, clean operation and mechanical stability are preferred. The pad accommodates slight surface irregularities while maintaining low thermal resistance for effective heat transfer from CPUs, GPUs, VRMs and other heat-generating modules.

Advantages

The Minus Pad Extreme 2 combines thermal conductivity with dimensional stability, offering a reusable, non-liquid interface that reduces the risk of spills and migration. Its uniform thickness and elastomeric characteristics enable straightforward placement and retention between components and cooling solutions. The pad's format simplifies retrofit and custom installations by eliminating the need for precise dispensing and curing associated with liquid thermal compounds.

Suitable for

• Cooling CPUs and GPUs in compact or custom systems
• Thermal coupling of VRMs, MOSFETs and power stages
• Retrofit cooling upgrades and prototype electronics
• Situations requiring a clean, non-flowing thermal interface

Key specifications

• Dimensions: 100 × 100 × 0.5 mm
• Form: solid thermal pad with conformable surface
• Primary function: gap filling and thermal conduction between components and heatsinks
• Compatibility: suitable for CPUs, GPUs, VRMs and other electronic modules requiring thermal interface material

How to use

Clean mating surfaces of dust, oils and old thermal material before application. Cut the pad to the required shape and size if necessary, then remove any protective liners and place the pad directly onto the component or heatsink, ensuring full contact across the interface. Apply even mechanical pressure by fastening the heatsink or enclosure to compress the pad slightly and establish consistent thermal contact. The pad can be removed and repositioned if needed during installation.

Usage recommendations

Use the pad where a stable, non-liquid interface is preferred and where the nominal 0.5 mm thickness matches the gap to be filled. For larger gaps or higher-pressure applications, consider measuring clearances and selecting appropriate pad thickness. Avoid exposing the pad to sharp edges or solvents, and store unused material in a dry, dust-free environment.