Thermal Grizzly Minus Pad Extreme 2 thermal pad, 100×100×1.5 mm, high-conductivity interface material

Thermal Grizzly Minus Pad Extreme 2 is a 100×100×1.5 mm thermal pad engineered to provide a stable, compliant thermal interface between heat-generating components and heatsinks. Designed for applications that require gap filling and electrical insulation, this non-liquid pad offers high thermal conductivity while maintaining mechanical flexibility. It is suitable for space-constrained electronics and high-power modules where reproducible contact and reliable heat transfer are essential.

Advantages

The thermal pad offers consistent thermal performance across varying surface unevenness and reduces the need for precise machining or spring pressure. Its soft, conformal nature ensures full contact over irregular surfaces, improving heat dissipation from CPUs, GPUs, power modules and voltage regulation components. Because it is non-liquid and electrically insulating, the pad lowers the risk of short circuits compared with liquid thermal compounds while simplifying installation and replacement.

Suitable for

• CPU and GPU cooling in compact systems and laptops
• Heat transfer for power modules and MOSFETs
• Thermal interface for VRMs and memory chips
• Gap filling between PCBs and heatsinks in industrial electronics

Key specifications

• Dimensions: 100 × 100 × 1.5 mm
• Form factor: solid, compressible thermal pad
• Function: thermal interface material for gap filling and heat conduction
• Electrical property: electrically insulating
• Application area: CPUs, GPUs, power modules, VRMs, memory and PCB-to-heatsink interfaces

How to use

Clean contacting surfaces thoroughly to remove dust, old thermal compound or grease and ensure dry, contaminant-free surfaces. Cut the pad to the required shape and size if necessary, then place it between the component and the heatsink, making sure it fully covers the contact area. Apply even mechanical pressure when fastening the heatsink to allow the pad to compress and conform to surface irregularities. For disassembly, peel the pad off gently and replace it if damaged or compressed beyond recovery.

Usage recommendations

Use the pad where electrical insulation is required and where a stable, non-flowing interface is preferred. Avoid exposing the pad to solvents or high abrasion. For best thermal performance, ensure flatness and cleanliness of mating surfaces and replace the pad if permanent deformation or contamination is observed.