Thermal Grizzly Minus Pad Extreme 2 thermal pad, 120×20×3 mm, pack of 2

Thermal Grizzly Minus Pad Extreme 2 is a compressible thermal interface pad sized 120×20×3 mm and supplied as a pack of two. It is engineered to bridge gaps between electronic components and heatsinks, providing consistent thermal conduction where traditional thermal pastes or pads may be impractical. The material fills uneven surfaces and reduces thermal resistance to support stable heat transfer in cooling systems for electronics, laptops, and custom PC builds.

Advantages

The pad offers a balance of thermal conductivity and mechanical compliance, allowing it to conform to surface irregularities while maintaining a reliable thermal pathway. Its pre-cut dimensions and supplied pair make it convenient for replacing worn pads or installing in dual-component assemblies. The compressible structure improves contact over larger gaps than thin pastes, and the non-liquid, non-curing composition simplifies application and later removal.

Suitable for

• Thermal bridging between chips, power stages, and heatsinks in desktop and compact PC systems
• Filling gaps in laptop cooling modules and replacing factory pads
• Cooling solution assembly for small form-factor electronics and embedded devices
• Prototyping and maintenance where repeatable installation and clean removal are required

Key specifications

• Dimensions: 120 × 20 × 3 mm per pad
• Pack quantity: 2 pads
• Form factor: compressible thermal interface pad designed for gap filling
• Compatibility: suitable for heatsinks, cold plates, and direct component interfaces in electronic cooling systems
• Application type: non-liquid, non-curing solid pad for easy installation and removal

How to use

Ensure both mating surfaces are clean and free of dust, oils, or old thermal materials before installation. Measure and, if necessary, cut the pad to fit the contact area without overlapping adjacent components. Place the pad between the component and heatsink, then assemble the cooling hardware using even pressure to achieve full contact and compression of the pad. Avoid excessive shear or stretching during placement; if repositioning is required, lift straight up and re-seat rather than sliding.

Usage recommendations

Use the pads where a reliable, removable thermal interface is needed, especially in areas with irregular surfaces or gap variation up to the pad thickness. Store unused pads in a clean, dry environment to preserve performance. For applications requiring maximum thermal conductivity in very thin gaps, consider comparing with alternative interface materials designed for ultra-low thickness.