Thermal paste Thermal Grizzly Putty Advance 100 g — high thermal conductivity, blue

Thermal Grizzly Putty Advance 100 g is a blue thermal compound formulated for high thermal conductivity and reliable heat transfer between electronic components and heatsinks. Supplied in a putty consistency, this 100 g quantity is intended for applications that require larger volumes of compound, enabling effective thermal coupling on CPUs, GPUs, power electronics and larger contact surfaces. The formulation balances spreadability and sustained contact to reduce thermal resistance and improve cooling efficiency in demanding assemblies.

Advantages

The putty form provides easy shaping and filling of uneven surfaces while maintaining constant thermal contact over time. High thermal conductivity improves heat dissipation from heat-generating components to attached heatsinks or cooling blocks. The product’s blue color allows visual confirmation of coverage during application and inspection without affecting performance. A 100 g package is suitable for multiple applications or for use in systems requiring substantial compound volumes.

Suitable for

• Thermal coupling between CPUs and large heatsinks in desktop systems
• GPU cooling solutions and custom water-cooling blocks
• Power electronics, MOSFETs, and voltage regulators with larger contact areas
• Heatsinks, cold plates and large surface interfaces where more compound is needed

Key specifications

• Form: putty-like thermal compound suitable for spreadable application
• Color: blue for visual coverage checks
• Net weight: 100 g
• High thermal conductivity formulation for efficient heat transfer
• Intended for use on CPUs, GPUs, power electronics and large contact surfaces

How to use

Ensure both mating surfaces are clean, dry and free of old thermal material, oils or debris. Take an appropriate amount of putty and place it on the heat source or heatsink surface; the putty can be molded to conform to uneven surfaces and then spread thinly to achieve full coverage. Attach the heatsink or cooling block and apply even pressure so the putty forms a continuous thermal interface. After installation, check for secure mechanical mounting and allow the assembly to operate briefly while monitoring temperatures to verify effective thermal coupling.

Usage recommendations

Use in well-ventilated environments and avoid contact with electrical contacts. Apply only the necessary amount to avoid excessive squeeze-out which may cause contamination of adjacent components. Store the product in a cool, dry place away from direct sunlight and reseal the container after use to preserve consistency.