Thermal pad Thermal Grizzly Minus Pad Basic 120×20×3.0 mm pack of 4

Thermal Grizzly Minus Pad Basic 120×20×3.0 mm pack of 4 is a set of soft thermal interface pads designed to provide consistent heat transfer between electronic components and heatsinks where thermal paste is impractical. Each pad measures 120×20×3.0 mm and offers electrical insulation while filling uneven surfaces and small gaps to improve thermal contact in laptops, small form-factor PCs and other compact devices.

Advantages

These thermal pads deliver reliable thermal conduction with a uniform thickness that simplifies installation compared to liquid or paste thermal compounds. Their soft, compliant material conforms to surface irregularities, reducing the risk of air pockets and maintaining contact under light mechanical stress. The pads are non-conductive electrically, helping prevent short circuits, and come in a pack of four for multiple components or spare replacements.

Suitable for

• Laptop CPU and GPU gap filling and heatsink contact
• Cooling upgrades in small form-factor PCs and mini-PCs
• Thermal interface for VRAM modules and power components on compact motherboards
• Repair and maintenance of consumer electronics with limited space for thermal paste

Key specifications

• Dimensions: 120 × 20 × 3.0 mm per pad
• Quantity: pack of 4 pads
• Material type: soft thermal interface pad providing both thermal conduction and electrical insulation
• Physical form: pre-cut rectangular pads suitable for trimming to fit
• Application temperature range: suitable for typical electronic cooling environments (room to elevated operating temperatures)

How to use

Ensure both mating surfaces are clean, dry and free of dust or old thermal compound. Measure and, if necessary, trim a pad to fit the component area precisely. Remove protective films from both sides of the pad and press it evenly between the component and heatsink, ensuring full surface contact without stretching. Reassemble the device and verify that mounting hardware applies even pressure to maintain consistent contact.

Usage recommendations

Use the pads in applications where a stable, insulated thermal interface is required and where liquid thermal paste is difficult to apply. Avoid using the pads on surfaces that require electrically conductive thermal material. For best results, check compatibility with component temperatures and replace pads if they become compressed or damaged during disassembly.