Thermal pad Thermal Grizzly Minus Pad Advance 120 x 20 x 1.0 mm pack of 4

Thermal Grizzly Minus Pad Advance thermal pads in dimensions 120 x 20 x 1.0 mm (pack of 4) are flexible, electrically insulating thermal interface materials designed to improve heat transfer where thermal paste is impractical. Each pad conforms to uneven surfaces and small gaps between chips, memory modules, VRMs and heatsinks, providing a reliable conductive path for heat away from sensitive components in compact assemblies and repair applications.

Advantages

The Minus Pad Advance material combines good thermal conductivity with flexibility, making it easy to cut to the required shape and apply to irregular surfaces without messy application. Pads are electrically insulating, so they can be used close to exposed circuitry while reducing thermal resistance across interfaces. Their 1.0 mm thickness is suitable for filling moderate air gaps and maintaining mechanical clearance in tight layouts.

Suitable for

• Thermal upgrades for laptops, small form-factor PCs and single-board computers
• Cooling memory modules (RAM) and VRM components on motherboards
• Repair and replacement of dried or inaccessible thermal paste on compact modules
• Small electronics assemblies where electrical insulation and gap filling are required

Key specifications

• Dimensions: 120 × 20 × 1.0 mm per pad
• Pack contents: 4 identical thermal pads
• Material type: flexible thermally conductive pad with electrical insulation
• Form factor: cut-to-fit sheet style for easy trimming to component size
• Typical application: fills gaps and conforms to uneven contact surfaces

How to use

Measure the area to be covered and cut the pad to the required shape using scissors or a sharp blade. Remove any dust, old thermal compound and oils from mating surfaces before applying the pad. Peel off the protective liners if present, place the pad onto the cooler or component so it fully covers the contact area, and press gently to ensure conformity. Reassemble the device, ensuring there is even pressure across the interface to maintain thermal contact.

Usage recommendations

For best results, choose the pad thickness that matches the gap at the interface and verify there is no shorting risk with nearby components. Avoid stretching the pad when fitting. If higher thermal conductance is required for large heat loads, consider combining this pad with an appropriate heatsink or alternate thermal solution.