Thermal pad Thermal Grizzly Minus Pad Pro 100×100×1.0 mm – high-conductivity thermal interface material

Thermal Grizzly Minus Pad Pro 100×100×1.0 mm is a high-conductivity thermal interface material designed to provide a compliant, gap-filling layer between heat-generating components and heatsinks. The pad offers a solid alternative to liquid thermal pastes by ensuring consistent contact across uneven surfaces while being easy to cut and position. It is intended for use where stable thermal transfer and mechanical insulation are required without the mess of pastes.

Advantages

The pad combines high thermal conductivity with electrical insulation, delivering improved heat dissipation for CPUs, GPUs, power modules and other electronic components. Its uniform thickness and flexible material conform to surface irregularities, reducing thermal resistance in compact assemblies. Installation is straightforward: the pad can be trimmed to size and applied without curing time, minimizing downtime during maintenance or assembly.

Suitable for

• Thermal bridging between ICs, power regulators and heatsinks
• Cooling solutions in small form-factor PCs and embedded systems
• Replacement of ceramic or silicone pads in power electronics modules
• Applications where non-liquid, reworkable thermal interface is preferred

Key specifications

• Dimensions: 100 × 100 × 1.0 mm
• Material type: compliant thermal pad (solid interface material)
• Thermal conductivity: high (manufacturer-rated for efficient heat transfer)
• Electrical properties: electrically insulating (suitable where isolation is required)
• Mechanical: flexible and cuttable for custom fitting
• Operating use: suitable for CPUs, GPUs, power modules and other electronic components

How to use

Measure the area to be covered and cut the Thermal Grizzly Minus Pad Pro to the required size with a sharp blade or scissors. Clean contact surfaces from dust, grease and old thermal material before application. Peel off the protective liner if present and place the pad firmly onto the component or heatsink, applying even pressure to achieve full contact. Assemble the parts and check alignment; no curing time is needed, and the pad can be repositioned immediately if necessary.

Usage recommendations

For optimal thermal performance, ensure mating surfaces are clean and flat where possible. Avoid compressing the pad beyond its recommended thickness to prevent loss of insulating properties. When used in devices with high vibration or frequent disassembly, verify that the pad remains properly seated after initial cycles and replace it if mechanical wear or deformation is observed.