Thermal pad Thermal Grizzly Minus Pad Pro 100×100×1.5 mm — high-performance thermal interface material

Thermal Grizzly Minus Pad Pro 100×100×1.5 mm is a high-performance thermal interface pad designed to transfer heat between electronic components and cooling solutions. The non-liquid, conformable pad provides consistent thermal contact for CPUs, GPUs, memory modules and power stages where a solid, non-curing alternative to paste is preferred. Supplied as a single sheet sized 100×100 mm with 1.5 mm thickness, it enables quick placement, repositioning and replacement during assembly or maintenance.

Advantages

The Minus Pad Pro offers stable thermal conductivity without the mess of liquid thermal pastes and without the risk of pump-out that can occur over time. Its thickness and compressibility deliver reliable gap filling between irregular surfaces while maintaining physical separation to prevent short circuits. The pad is cuttable to size for custom installations and suitable for repeated handling during testing and rework.

Suitable for

• Heat transfer between CPU/GPU and heatsinks in compact builds
• Thermal bridging for memory modules, VRMs and MOSFETs
• Prototyping, testing and temporary cooling solutions
• Applications where a non-liquid, non-curing interface is required

Key specifications

• Sheet dimensions: 100 × 100 mm
• Thickness: 1.5 mm
• Material type: solid thermal interface pad (non-liquid, non-curing)
• Thermal conductivity: high-performance grade suitable for consumer and enthusiast electronics
• Compressibility: conforms to surface irregularities for improved contact
• Electrical insulation: provides physical separation to reduce short-circuit risk

How to use

Clean both mating surfaces of dust, old residues and oils prior to application. Cut the sheet to the required shape with a clean blade and remove any protective liners. Position the pad onto the cooler or component, align it carefully, then apply uniform pressure when assembling the cooling solution to ensure full contact. For removal, gently lift the pad and replace if contaminated or compressed beyond effective performance.

Usage recommendations

Store the pad in a dry, dust-free environment away from direct sunlight. Avoid stretching or tearing the material during cutting and assembly. For optimal thermal transfer, ensure even mounting pressure and verify that the pad fully covers the heat source without obstructing surrounding components.