Thermal pad Thermal Grizzly Minus Pad Pro 100×100×2.0 mm — high-performance thermal interface

Thermal Grizzly Minus Pad Pro 100×100×2.0 mm is a preformed thermal interface pad designed to provide stable and uniform thermal conduction between heat-generating components and heatsinks. The sheet-format pad fills microscopic surface irregularities, creating an even contact layer that improves heat transfer without the mess or curing time associated with thermal pastes. Its 100×100 mm square shape and 2.0 mm thickness are suitable for larger contact areas commonly found on CPUs, GPUs, power stages and other electronic modules.

Advantages

The pad offers consistent thermal performance across its full surface, reducing hotspots and enabling predictable cooling behavior. It is easier and faster to install than paste, requires no drying or reapplication, and minimizes the risk of short circuits since it is non-conductive. The solid format also allows for clean removal and replacement during maintenance or component swaps.

Suitable for

• CPU and GPU heat spreaders with square or rectangular contact areas
• VRM and MOSFET cooling on motherboards and graphics cards
• Power supplies, voltage regulators and other power electronics
• Custom cooling assemblies and DIY thermal management projects

Key specifications

• Dimensions: 100 × 100 mm
• Thickness: 2.0 mm
• Form: solid thermal interface pad (sheet)
• Thermal interface type: gap-filling pad designed for direct component-to-heatsink contact
• Electrical properties: electrically non-conductive (designed to reduce short-circuit risk)
• Application: reusable and removable for maintenance and rework

How to use

Measure and cut the pad to match the contact area if necessary, then remove any protective liners. Clean and degrease both component and heatsink contact surfaces to ensure optimal adhesion and thermal contact. Place the pad so that it fully covers the heat source and press the heatsink down evenly to distribute the pad and eliminate air gaps. If trimming is required, use a sharp blade and make precise cuts to avoid frayed edges. For disassembly, gently separate the heatsink and peel the pad away; the pad can be replaced when worn or contaminated.

Usage recommendations

Use the pad in environments within the component manufacturer's specified temperature range and avoid exposing the pad to aggressive solvents. For maximum thermal conductivity in tight gap applications, ensure surfaces are clean and apply even mechanical pressure from the heatsink. Replace the pad if it shows signs of compression set, contamination, or reduced contact quality during routine maintenance.