Thermal pad Thermal Grizzly Minus Pad Pro 120×20×0.5 mm pack of 2

Thermal Grizzly Minus Pad Pro thermal pads, sized 120×20×0.5 mm and supplied as a pack of two, are engineered to provide stable thermal conduction between electronic components and heatsinks where controlled gap filling is required. The pads combine soft compressibility with consistent thermal transfer, enabling improved heat dissipation without the need for liquid or paste. Their slim 0.5 mm thickness is suitable for tight tolerances in compact builds, and the material is electrically insulating to reduce the risk of shorts when applied near exposed contacts.

Advantages

The Minus Pad Pro offers consistent and repeatable thermal performance across its surface, with easy cut-to-size handling for customized installations. Its thin profile maintains low thermal resistance while fitting narrow gaps between components and cooling solutions. The electrically insulating composition permits safe placement around memory modules, power components, and other sensitive circuitry. Supplied as a pack of two, the pads provide spare material for multi-point installations or future maintenance.

Suitable for

• Thermal bridging between CPUs/GPUs and compact heatsinks where thin gap filling is required
• Cooling memory modules, VRMs, MOSFETs and power components on motherboards and graphics cards
• Small form-factor electronics, embedded systems and custom cooling layouts
• Repair, upgrade or prototype work that requires easy-to-cut pads and electrical insulation

Key specifications

• Dimensions: 120 × 20 × 0.5 mm per pad
• Pack contents: 2 identical thermal pads
• Material properties: soft, compressible thermal interface with electrical insulation
• Thermal behavior: designed for consistent thermal conduction and low thermal resistance in thin gaps
• Compatibility: suitable for metal heatsinks, aluminium and copper contact surfaces

How to use

Measure the gap between the component and the heatsink, then cut the pad to the required shape using scissors or a sharp blade on a flat surface. Clean contact surfaces to remove dust, grease or old thermal compounds. Peel off protective liners and place the pad so it makes full contact with both the component and heatsink; apply uniform pressure to ensure even compression. Reassemble the device and verify mechanical fit and thermal behaviour during initial operation.

Usage recommendations

For optimal results, use the pads where a thin, electrically insulating thermal interface is needed. Avoid overstretching or compressing beyond intended mechanical tolerances. Do not use as a substitute for adhesive or mechanical mounting; ensure the heatsink is securely fastened. Store unused pads flat in a clean, dry environment away from direct sunlight.