Thermal pad Thermal Grizzly Minus Pad Pro 120×20×2.0 mm pack of 2

Thermal Grizzly Minus Pad Pro 120×20×2.0 mm pack of 2 is a set of pre-cut thermal interface pads designed to provide efficient heat conduction between electronic components and heatsinks. Each pad measures 120×20×2.0 mm and the pack includes two pads, enabling direct replacement of worn or inadequate interfaces or use in compact cooling upgrades. The material conforms to irregular surfaces and transfers heat without the need for curing, making it suitable for tight assemblies and devices where reliable contact is required.

Advantages

The Minus Pad Pro offers consistent thermal performance across its area, simplified installation due to its ready-to-fit shape, and stable mechanical compliance that accommodates small surface unevenness. Because it does not require curing, downtime for application is minimized and the pads remain serviceable for easy maintenance or replacement. Their softness helps ensure uniform contact pressure and reduces the risk of damaging delicate components during installation.

Suitable for

• Thermal interface replacement in laptops, mini-PCs and game consoles
• Cooling upgrades for small form-factor motherboards and expansion cards
• Heat conduction between power components (MOSFETs, regulators) and heatsinks
• Prototyping and repair tasks where repeatable, non-curing thermal contact is needed

Key specifications

• Dimensions: 120 × 20 × 2.0 mm (each pad)
• Quantity: pack of 2 pads
• Material: soft, conformable thermal interface pad
• Thermal behavior: designed for passive heat conduction without curing
• Application type: pre-cut sheets for direct placement between component and heatsink

How to use

Ensure both mating surfaces are clean, dry and free of dust or old thermal compound. Remove protective films from the pad and align it with the component and heatsink, applying gentle, even pressure to establish full contact. If necessary, trim the pad to fit irregular layouts using a sharp blade or scissors. Reassemble the device according to manufacturer instructions and verify mechanical stability before powering on.

Usage recommendations

For best results, use the pads where a pre-cut, non-curing thermal interface is preferred over liquid thermal pastes. Avoid excessive compression beyond recommended mounting pressure and keep the pads away from open circuitry that could be shorted by conductive additives. Inspect and, if needed, replace pads during maintenance cycles or after several thermal cycles to maintain optimal heat transfer.