Mouse pad Thermal Grizzly TG Minus Pad Extreme V2

The Thermal Grizzly TG Minus Pad Extreme V2 is a high-performance thermal interface pad designed for targeted heat dissipation in compact electronic assemblies. Measuring 120 x 20 x 0.5 mm and supplied as a pack of two, this mouse pad–style thermal pad is intended for applications where efficient thermal transfer and a thin profile are required. The product is produced under the Thermalright brand and is suitable for use between heat-generating components and heat spreaders or chassis surfaces where a conformable, thermally conductive gap-filler is needed.

Advantages

The TG Minus Pad Extreme V2 offers consistent thermal conductivity in a thin form factor, enabling improved heat transfer across small gaps without adding significant bulk. Its supplied pair allows for simultaneous or spare use, and the cut dimensions make it straightforward to position on rectangular or elongated components. The material is engineered to provide reliable contact with uneven surfaces, reducing thermal resistance and supporting stable operating temperatures for sensitive electronics.

Suitable for

• Thermal bridging between small PCBs, modules, or chips and heatsinks or chassis
• Crowded enclosures where a low-profile thermal gap filler is required
• Cooling of compact devices such as single-board computers, modules, or power regulators
• Replacement or supplement for existing thin thermal pads in confined assemblies

Key specifications

• Dimensions: 120 x 20 x 0.5 mm
• Quantity: pack of 2 pads
• Form factor: thin rectangular pad suitable for narrow contact areas
• Function: thermally conductive gap filler for heat dissipation

How to use

Clean both mating surfaces to remove dust, grease, and loose particles before application. Measure and, if necessary, cut the TG Minus Pad Extreme V2 to fit the contact area precisely, ensuring full coverage of the heat source and the mating cooler or chassis. Place the pad so it makes firm contact with both surfaces; light pressure may help conform the material to small surface irregularities. If multiple pads are used, align them to avoid gaps in coverage. Monitor operating temperatures after installation to confirm improved thermal performance.

Usage recommendations

Store unused pads in a dry, dust-free environment and avoid exposure to solvents or strong mechanical abrasion. For best results, use the pads where thin, conformable thermal interface material is required; for high-gap or pressure-sensitive applications, consider compatible alternatives designed for larger gaps or different mechanical conditions.