Mouse Pad Thermal Grizzly TG Minus Pad Extreme V2

The Thermal Grizzly TG Minus Pad Extreme V2 is a high-performance thermal interface pad designed to improve heat transfer between components and cooling solutions. With dimensions of 120 x 20 x 1.5 mm, this mouse pad–style thermal pad provides a compact, flexible solution for filling gaps and ensuring consistent thermal contact in tight assemblies. It is engineered to offer reliable thermal conductivity while remaining easy to cut and place where precise coverage is required.

Advantages

The TG Minus Pad Extreme V2 delivers high thermal conductivity in a thin, pliable material suitable for small form-factor and confined spaces. Its uniform thickness and flexible structure allow for effective gap filling and consistent pressure distribution across surfaces. The pad is simple to trim to custom shapes and stays compliant under mounting pressure, improving long-term thermal interface stability without requiring liquid thermal compounds.

Suitable for

• Enhancing heat transfer between chips, modules, and heatsinks in compact electronics
• Filling small gaps in GPU, CPU, VRM, and memory cooling assemblies
• Retrofits and repairs where a solid, non-liquid thermal interface is preferred
• Custom cooling projects and small-scale thermal management tasks

Key specifications

• Dimensions: 120 x 20 x 1.5 mm
• Physical form: flexible thermal interface pad
• Material behavior: compliant, easy to trim and shape
• Intended use: gap filling and thermal coupling between surfaces
• Compatibility: suitable for small electronic components and compact cooling setups

How to use

Clean both contact surfaces to remove dust, grease, and old thermal materials before applying the pad. Measure and cut the TG Minus Pad Extreme V2 to match the contact area, ensuring full coverage of the heat-generating surface without overhanging adjacent components. Place the pad between the component and heatsink, then reassemble the cooling solution and apply even mounting pressure to secure firm contact. If repositioning is necessary, carefully remove and replace with a fresh piece to maintain optimal conductivity.

Usage recommendations

Use the pad in environments where a solid, non-liquid thermal interface is preferable; avoid exposure to fluids and prolonged mechanical abrasion. For best results, pair the pad with properly sized heatsinks and even mounting pressure. Store unused material flat in a dry, dust-free location away from direct sunlight.