Thermal paste THOMAS Aeronaut TG-A-015-R — 8.5 W/m·K, 3.9 g (1.5 ml), operating -150–200°C

THOMAS Aeronaut TG-A-015-R is a high-performance thermal paste formulated for efficient heat transfer between processors, graphics chips and their cooling solutions. With a thermal conductivity of 8.5 W/m·K, density of 2.6 g/cm³ and a net weight of 3.9 g (1.5 ml), this compound fills microscopic gaps between chip and cooler surfaces to reduce thermal resistance. The product supports a wide operating temperature range from -150°C to 200°C, making it suitable for demanding thermal environments and maintaining stable thermal contact under extreme conditions.

Advantages

THOMAS Aeronaut TG-A-015-R offers a balanced combination of thermal performance and long-term stability. Its relatively high thermal conductivity improves heat dissipation compared with general-purpose compounds, while the specified density and controlled paste volume enable precise application for small and standard CPU/GPU contacts. The wide operating temperature range ensures the material remains functional in both low-temperature and high-temperature scenarios without significant degradation of thermal transfer properties.

Suitable for

• Desktop and laptop CPUs where improved heat transfer is required
• Graphics processing units (GPUs) and gaming consoles
• Small-form-factor systems and compact cooling assemblies
• Electronics and devices operating in a wide temperature range, including low-temperature conditions

Key specifications

• Thermal conductivity: 8.5 W/m·K
• Net weight / volume: 3.9 g (1.5 ml)
• Density: 2.6 g/cm³
• Operating temperature range: -150°C to 200°C
• Form: thermal interface paste for chip-to-cooler contact

How to use

Ensure both the chip surface and cooler contact area are clean, dry and free of old compound or contaminants before application. Apply a small, pea-sized amount of THOMAS Aeronaut TG-A-015-R to the centre of the chip or use a thin, even line for elongated dies. Mount the cooler and apply even pressure to spread the paste into a thin, continuous layer; avoid excessive quantities that can increase thermal resistance. Reassemble the cooling system and verify secure contact. For best results, follow component manufacturer instructions regarding torque and mounting sequence.

Usage recommendations

Use this thermal paste for direct chip-to-heatsink applications on CPUs and GPUs. Because of its high thermal conductivity and wide temperature tolerance, it is appropriate for systems that experience both low and high temperature extremes. Store the product in a cool, dry place and reseal the container after use to maintain paste consistency.