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Product specification Transcend MTE652T2 M.2 256 GB PCI Express 3.1 3D TLC NAND NVMe
Features
Features
SSD capacity:
256 GB
SSD form factor:
M.2
Certification:
CE/FCC/BSMI
Mean time between failures (MTBF):
3000000 h
Memory type:
3D TLC NAND
ECC:
No
Random write (4KB):
235000 IOPS
Random read (4KB):
165000 IOPS
Component for:
PC/Laptop
NVMe:
No
NVMe version:
1.3
Sequential read speed (CDM):
2100 MB/s
Sequential write speed (CDM):
1000 MB/s
Interface:
PCI Express 3.1
Technical details
Sustainability certificates:
RoHS
Weight & dimensions
Weight:
0.009 kg
Height:
3.58 mm
Width:
80 mm
Depth:
22 mm
Power
Power consumption (sleep):
0.6 W
Operating voltage:
3.3 V
Power consumption (read):
3.3 W
Power consumption (write):
3.3 W
Operational conditions
Operating relative humidity (H-H):
5 - 95
Storage temperature (T-T):
-40 - 85
Operating temperature (T-T):
-20 - 75
Operating shock:
1500 G
Operating vibration:
20 G
Description
Advantages
- - DRAM Cache embedded
- - 30µ" PCB gold finger
- - Endurance: 3K P/E cycles (Program/Erase cycles) guaranteed
- - PCIe Gen 3 x4 interface
- - Key components fortified by default with Corner Bond technology
- - Compliant with PCI Express specification 3.1
- - Compliant with NVM Express specification 1.3
- - Supports NVM command
- - SLC caching technology
- - Built-in LDPC ECC (Error Correction Code) functionality
- - Dynamic thermal throttling
- - Compliant with RoHS 2.0 standards
- - Supports Transcend SSD Scope Pro software
256GB, M.2 2280, PCIe Gen3x4, M-Key, 3D TLC
Transcend's MTE652T2 M.2 SSD features the PCI Express (PCIe) Gen 3 x4 interface and is compatible with NVM Express (NVMe) 1.3 specifications, delivering unparalleled transfer speeds. The MTE652T2 features the latest 3D NAND technology for higher storage efficiency, 30µ" PCB gold finger and Corner Bond technology for enhanced durability, built-in DRAM cache for fast access, an extended operating temperature range from -20°C to 75°C, and an endurance rating of 3K Program/Erase cycles for reliable operation.
