Thermal Pad XILENCE XZ028 1 mm, 10 W/mK thermal conductivity

XILENCE XZ028 is a 1 mm thick thermal pad with 10 W/mK thermal conductivity designed to improve heat transfer between electronic components and heatsinks. The soft, compliant material fills uneven surfaces and microscopic gaps, offering a stable solid-state thermal interface that reduces thermal resistance without the mess or curing time associated with thermal pastes. The pad is cut-to-fit and maintains consistent thickness to ensure predictable thermal performance in compact cooling assemblies.

Advantages

The 10 W/mK thermal conductivity provides a balance of high heat transfer and ease of handling, while the 1 mm thickness accommodates moderate gaps between components and heatsinks. Its dielectric, non-liquid composition eliminates the risk of short circuits and simplifies installation and maintenance. The pad's compliance reduces the need for precise mechanical pressure and compensates for surface irregularities, contributing to stable thermal contact over time.

Suitable for

• Thermal bridging between CPU or GPU packages and aftermarket heatsinks in compact or low-profile builds
• Cooling VRMs, MOSFETs and power delivery components on motherboards and graphics cards
• Thermal interfaces in small form-factor PCs, NAS units, and embedded systems
• Replacement of worn or messy thermal paste where a solid, re-usable interface is preferred

Key specifications

• Thickness: 1 mm
• Thermal conductivity: 10 W/mK
• Form: soft, compliant thermal pad
• Electrical properties: electrically insulating (solid, non-liquid)
• Installation: cut-to-fit, solid-state interface — no curing required

How to use

Before installation, clean contacting surfaces to remove dust, grease and residues using isopropyl alcohol or a manufacturer-recommended cleaner. Measure and cut the thermal pad to match the contact area, ensuring full coverage of the heat-generating component and alignment with the heatsink surface. Place the pad between the component and heatsink, apply gentle and even pressure to seat the pad and remove trapped air. Reassemble the device according to component manufacturer torque specifications to maintain consistent contact.

Usage recommendations

Use the 1 mm thickness for moderate gap fills; if gaps are larger or smaller, select a pad with appropriate thickness to avoid excessive compression or insufficient contact. Avoid stretching the pad during installation and ensure edges do not contact solder joints or exposed conductors. For repeated removal and reinstallation, inspect the pad for deformation and replace if compression set reduces contact area.