Short product description:
QOLTEC 51641 is a thermal paste for improving heat transfer between electronic components and heat sinks. It offers thermal conductivity of 3.05 W/m·K and thermal resistance of 0.073 °C/W in a 0.5 g syringe/pack. The product is gold-coloured and supplied as a single 0.5 g unit, suitable for CPU, GPU or power device contact surfaces and small electronics cooling tasks.