Thermal Conductive Paste AG TermoPasty H 25 g by AG TermoPasty

Thermal Conductive Paste AG TermoPasty H 25 g by AG TermoPasty is a thermally conductive compound supplied in a 25 g syringe for controlled application between heat-generating electronic components and heatsinks. The paste is formulated to reduce thermal resistance at the interface of CPUs, GPUs, power transistors and other components, improving heat transfer to cooling solutions while remaining suitable for installation and maintenance tasks where precise dosing is needed.

Advantages

This thermal paste provides consistent thermal conductivity and easy application from a refillable syringe, enabling accurate placement and minimal waste. The formulation maintains stability under normal operating temperatures and offers good contact filling for micro-imperfections on component surfaces, which helps to lower junction temperatures. The syringe design supports repeatable dosing for multiple applications or servicing tasks.

Suitable for

• Desktop and laptop CPUs and GPUs
• Power transistors and MOSFETs in power electronics
• Heatsinks and cold plates in cooling assemblies
• Repair, upgrade and routine maintenance of electronic assemblies

Key specifications

• Net quantity: 25 g syringe for precise application
• Form: paste/compound suitable for filling micro-gaps
• Primary function: reduce thermal resistance between component and heatsink
• Compatibility: intended for use on semiconductor packages and metal heatsinks
• Application method: syringe dispenser for controlled dosing

How to use

Before applying the thermal paste, clean both the component and heatsink contact surfaces with a lint-free cloth and suitable solvent to remove old compound, grease and dust. Apply a small, even amount of paste from the syringe to the centre of the chip or to the heatsink contact area according to the component size; avoid excess which can spill over. Mount the heatsink and secure it with the usual mounting mechanism, allowing the compound to spread under clamping pressure to form a thin thermal interface layer. If servicing, remove old paste and repeat the same steps for re-application.

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