Thermal Paste AG TermoPasty 600 ml AGT-233 — high-capacity thermal compound

Thermal paste AG TermoPasty 600 ml AGT-233 — high-capacity thermal compound is formulated to improve thermal transfer between electronic components and heatsinks in large-scale and repetitive applications. Supplied in a 600 ml volume, this thermal compound is intended for use where high fill volume and consistent thermal interface performance are required, including industrial equipment assembly, data center maintenance, and mass PC production. The product is designed for application on CPUs, GPUs, power modules and other heat-generating components where improved contact and heat dissipation are needed.

Advantages

The high-capacity container reduces the frequency of repurchasing for large projects and supports continuous application in production environments. The compound provides stable thermal conductivity when applied correctly and is compatible with standard heatsink mounting methods. Its consistency is formulated for both manual and mechanical dispensing to enable uniform layers and reliable thermal contact over extended operational periods.

Suitable for

• Industrial electronic assemblies and control cabinets
• Server farms and data centre cooling maintenance
• Mass PC assembly lines and refurbishment workshops
• Cooling interfaces for CPUs, GPUs and power modules

Key specifications

• Volume: 600 ml container suitable for large-volume use
• Type: high-capacity thermal compound designed for thermal interface applications
• Application method: suitable for manual or mechanical dispensing
• Compatibility: designed for use between heatsinks and semiconductor components such as CPUs, GPUs and power modules
• Performance focus: stable thermal conductivity and reliable contact over extended operation

How to use

Prepare both surfaces by ensuring they are clean, dry and free of old thermal compound, dust or grease. Apply an appropriate amount of thermal paste to the component surface according to component size and manufacturer guidance; for large-scale applications, use calibrated dispensing equipment for consistent layer thickness. Mount the heatsink and fasten according to the heatsink and device manufacturer's instructions to achieve even pressure and a thin, uniform compound layer. After application, verify contact and temperatures during initial operation to confirm correct installation.

Usage recommendations

Store the container in a cool, dry place away from direct sunlight and extreme temperatures. Use suitable personal protective equipment when dispensing in bulk, ensure proper ventilation, and follow workplace safety procedures. For best thermal performance, follow component manufacturer guidelines on thermal interface thickness and reapplication intervals specific to your equipment and operating conditions.