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Flux rosin paste AG TermoPasty AGT-033 20 g — rosin flux for soldering
Flux rosin paste AG TermoPasty AGT-033 20 g — rosin flux for soldering
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Flux rosin paste AG TermoPasty AGT-033 20 g — rosin flux for soldering
Leave your address - as soon as the price of the product goes down, you'll know about it right away
Flux rosin paste AG TermoPasty AGT-033 20 g — rosin flux for soldering
Flux rosin paste AG TermoPasty AGT-033 20 g — rosin flux for soldering
AG TermoPasty AGT-033 rosin paste flux in a 20 g container is formulated for manual soldering and rework tasks. The compact jar holds a concentrated rosin-based paste that assists in oxide removal, improves wetting of solder to metal surfaces and supports formation of stable solder joints. The product is intended for localized application where controlled flux deposition is required, such as through-hole and surface-mount repairs, component replacement and small assembly jobs.
This rosin paste flux provides efficient oxide cleaning and promotes consistent solder flow for reliable joints. Its paste consistency enables precise application to pads, component leads and small areas without excessive spreading. The compact packaging protects the flux between uses and is convenient for bench repair or field service work. Compatibility with common solder alloys used in electronics ensures predictable solderability when applied correctly.
Apply a small amount of the rosin paste to the solder pad or component lead prior to heating. For precise placement use a fine-tip applicator, soldering iron tip or micro-brush to transfer the paste. Heat the joint with an appropriate soldering iron and introduce solder to the wetted area; the flux will activate, remove oxides and promote solder flow. After soldering, clean residual flux from the board if required by the assembly process or conformal coating compatibility; if residues are acceptable for the application, cleaning may be omitted according to the end-use requirements.
Use appropriate personal protective equipment and work in a well-ventilated area. Store the container closed at room temperature and avoid contamination of the paste with foreign materials. Test compatibility with specific solder alloys and cleaning solvents on a sample board before full-scale application.
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