Soldering Paste AG TermoPasty CHE1405 — Flux Paste 100 g

AG TermoPasty CHE1405 — Flux Paste 100 g is a compact soldering paste formulated to support manual soldering and rework of electronic components and printed circuit boards (PCBs). The paste improves wetting, reduces surface oxidation during heating, and helps solder flow to form cleaner, more reliable joints. Packaged in a 100 g container, this flux paste is suitable for technicians performing component replacement, touch-up soldering, and localized repairs where controlled flux application is required.

Advantages

The flux composition promotes consistent solder wetting and reduces the likelihood of solder bridges and cold joints by facilitating uniform solder flow. Its paste form allows targeted application to pads and component leads, minimizing excess flux on surrounding areas. The product is formulated for rework and manual soldering processes, providing stable performance during typical leaded and lead-free soldering temperature profiles. The compact 100 g packaging provides a practical quantity for repair stations and small production runs.

Suitable for

• Manual through-hole soldering and rework of PCB components
• Soldering and replacement of surface-mount devices in repair operations
• Localized solder touch-ups and point repairs on electronic assemblies
• Use by technicians in service centers and small-scale electronics workshops

Key specifications

• Form: compact paste for controlled application
• Net weight: 100 g container
• Intended use: manual soldering and rework on PCBs and electronic components
• Function: improves wetting, reduces oxidation, promotes solder flow
• Compatibility: suitable for common leaded and lead-free soldering processes

How to use

Apply a small amount of the flux paste to the pad or component lead using a suitable tool such as a wooden stick, disposable applicator, or brush. Perform soldering with a soldering iron, hot air rework station, or other appropriate heating tool, following standard temperature settings for the solder alloy in use. Remove excess flux residues after cooling if necessary, using a cleaning solvent or flux remover compatible with the PCB and components. Observe standard safety precautions, such as adequate ventilation and protective gloves, while handling and heating the paste.

Usage recommendations

For best results, use minimal flux sufficient to achieve wetting and solder flow; avoid applying excessive paste that may require extensive cleaning. Test on a spare board when changing between leaded and lead-free solders to confirm temperature settings and wetting behavior. Store the container tightly closed at room temperature and protect from direct sunlight to maintain paste consistency.