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Thermal Paste AG TermoPasty Kontakt U 300 ml – heat transfer compound, 300 ml tube
AG TermoPasty Kontakt U is a heat transfer compound supplied in a 300 ml tube, formulated to improve thermal contact between electronic components and heatsinks. The paste fills microscopic air gaps and surface irregularities to reduce thermal resistance and support reliable heat dissipation in maintenance, repair and industrial assembly tasks.
The product provides consistent thermal conductivity across mating surfaces and maintains contact under common operating conditions. Supplied in a 300 ml tube, the compound is convenient for repeated applications and larger repairs. Its formulation is intended for use on typical electronic assemblies and heat-dissipating components, helping to optimize component temperature control without introducing mechanical fastening changes.
Prepare both surfaces by cleaning away old thermal material, dust and oils to ensure a dry, contaminant-free contact area. Apply an even, thin layer of the thermal paste to one of the mating surfaces; avoid excessive amounts that can migrate beyond the contact area. Assemble the components and secure them according to the equipment manufacturer's instructions to achieve a uniform thickness of the compound between surfaces.
Use personal protective equipment as required by local safety guidelines when handling thermal compounds. Ensure compatibility with component materials and follow equipment manufacturer limits for operating temperatures and mounting pressure. Store the tube in a cool, dry place and reseal after use to preserve the compound's properties.
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