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Thermal Paste AG TermoPasty Smar TF 60 g — AG AGT-066
AG TermoPasty Smar TF thermal paste in a 60 g tube is a high-density thermal interface compound formulated to improve heat transfer between processors, graphics chips and cooling solutions. The paste is designed for use where a reliable conductive medium is required to fill microscopic gaps between a heatsink and an electronic component, helping lower operating temperatures and maintain stable thermal contact over time.
This thermal paste offers consistent viscosity for easy application, long-term thermal stability and low electrical conductivity to reduce the risk of short circuits. The 60 g tube format provides sufficient quantity for multiple applications or professional maintenance tasks. The composition supports effective heat dissipation while remaining compatible with common heatsink and cooling materials.
Clean both the processor surface and the heatsink contact area from old thermal material, dust and grease using isopropyl alcohol and a lint-free cloth. Apply a small, even amount of AG TermoPasty Smar TF to the centre of the chip or in a thin, continuous line depending on the component size. Mount the heatsink and apply moderate pressure to spread the paste evenly; secure the cooling solution according to the manufacturer’s instructions. Avoid excessive paste quantities to prevent spillover and ensure optimal thermal contact.
Store the tube in a cool, dry place away from direct sunlight. For repeated professional or workshop use, keep the cap tightly closed to prevent drying. Follow safety guidelines: avoid skin and eye contact and use in a well-ventilated area. Replace thermal paste during major maintenance or if thermal performance degrades.
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