Thermal pad Alphacool Core 50×50×0.25 mm

Thermal pad Alphacool Core 50×50×0.25 mm is a thin, flexible thermal interface material engineered to fill small gaps between heatsinks and electronic components. With a 50×50 mm footprint and 0.25 mm thickness, this thermal pad improves contact between surfaces where standard thermal paste or thicker pads are impractical. It is suitable for compact cooling assemblies and small modules where precise, low-profile thermal conduction is required.

Advantages

The Alphacool Core thermal pad offers consistent thickness and uniform compressibility to ensure reliable thermal contact. Its thin 0.25 mm profile allows for use in tight clearances while still providing enhanced heat transfer compared with bare air gaps. The pad is easy to cut to shape and apply, reducing assembly time and minimizing mess compared with liquid thermal compounds. It is electrically non-conductive and designed for stable mechanical properties over repeated mounting cycles.

Suitable for

• Thermal coupling of chips, MOSFETs and voltage regulators
• Small heatsinks and compact cooling modules in PCs and embedded devices
• Filling thin gaps between circuit board components and metal contact plates
• Upgrades or repairs where a low-profile thermal interface is required

Key specifications

• Dimensions: 50 × 50 mm
• Thickness: 0.25 mm
• Material type: soft, compressible thermal pad
• Surface finish: smooth for improved contact
• Electrical properties: electrically non-conductive
• Application form: sheet, cut-to-size

How to use

Clean both mating surfaces to remove dust, oils and old thermal material. Cut the thermal pad to the required shape with scissors or a precision knife, matching the component footprint. Peel off any protective liners, place the pad onto the component or heatsink, and assemble the cooling parts ensuring even pressure across the contact area. For best results, secure mounting hardware to the recommended torque to avoid excessive compression or movement.

Usage recommendations

Store the thermal pad in a cool, dry place away from direct sunlight and solvents. Avoid stretching the material during application and replace the pad if it becomes contaminated or mechanically damaged. For applications requiring different thermal resistance or larger gap filling, select a pad with appropriate thickness and thermal conductivity.