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Thermal pad Alphacool Core 50×50×0.25 mm
Summary description:
Thermal pad Alphacool Core 50×50×0.25 mm is a thin thermal interface material designed to fill small gaps between heatsinks and components. With dimensions 50×50 mm and thickness 0.25 mm, it provides improved thermal contact for electronic parts such as chips, MOSFETs or small modules. Easy to cut and apply, it helps stabilise temperatures and enhance heat transfer in compact cooling assemblies.