Thermal pad Arctic TP-3 Premium Performance 200x100mm 0.5mm

Ensure the lowest thermal resistance with award-winning thermal interfaces. The high-performance MX thermal compound is recognized for consistent quality and strong results in performance tests. It provides very low thermal resistance through a minimal bond line thickness and is formulated for straightforward application by users of all experience levels. Complementary thermal pads are available in multiple designs and sizes to meet different cooling needs.

Advantages

Low thermal resistance achieved by a minimal bond line thickness improves heat transfer between components. The MX thermal compound has a proven track record in performance tests and is designed for easy application, including for beginners. A range of thermal pads offers additional options for situations where paste is not suitable.

Key specifications

• Product type: high-performance thermal compound (MX) and thermal pads
• Performance: very low thermal resistance
• Bond line: minimal thickness for efficient heat transfer
• Application: easy to apply, suitable for beginners
• Accessories: thermal pads in various designs and sizes

How to use

Clean mating surfaces thoroughly before application. Apply a thin, even layer of the MX thermal compound to the component that generates heat, then assemble the parts to achieve a minimal bond line thickness. For installations where a reworkable or spacer solution is preferred, select an appropriately sized thermal pad and position it between the surfaces according to the pad manufacturer’s guidelines.

Recommendations

Use the MX thermal compound for direct die-to-heatsink interfaces where minimal thermal resistance is required. Choose thermal pads for mechanical spacing, larger gaps, or where easy replacement is needed. Follow standard safety and handling instructions and consult device specifications for compatibility.