Solder Wick BLOW 2.5 mm x 150 cm - Desoldering Braid 2.5mm Width, 150cm Length

Solder Wick BLOW 2.5 mm x 150 cm is a copper desoldering braid designed to remove excess solder from printed circuit boards, component leads and pads. With a 2.5 mm working width and 150 cm total length, this desoldering braid suits small to medium size joints and provides enough material for multiple repair and rework operations. The copper weave quickly absorbs molten solder when heated by a soldering iron, enabling controlled and precise desoldering without using flux-core solder removal tools.

Advantages

The fine copper braid construction ensures efficient capillary action for rapid solder uptake and reduced heat exposure to surrounding components. The 2.5 mm width balances accessibility in confined PCB areas with sufficient surface contact for effective solder removal. A 150 cm length gives extended runtime for repeated use during repair jobs, prototyping and maintenance. The braid is compatible with standard soldering irons and common solder alloys, facilitating straightforward integration into existing repair workflows.

Suitable for

• Removing excess solder from component pads and through-hole leads
• Reworking SMD and through-hole components in electronics repair
• Cleaning solder bridges and fine pitch joints
• Prototyping and PCB rework in hobbyist and professional settings

Key specifications

• Material: copper braid suitable for solder absorption
• Working width: 2.5 mm
• Length: 150 cm
• Construction: woven copper filaments for capillary action
• Compatibility: designed for use with standard soldering irons and common solder alloys

How to use

Place the solder wick over the area with excess solder, then press the heated soldering iron tip onto the braid so heat transfers through the braid to the solder. As the solder melts, it will be drawn into the copper weave by capillary action. Remove the iron and braid together once the solder has been absorbed and allow the joint to cool. If necessary, cut or unwind a fresh section of braid to expose clean copper for subsequent use. Avoid prolonged heating of the surrounding PCB or components to prevent thermal damage.

Usage recommendations

For best results use a clean section of braid for each critical joint and moderate soldering iron temperature appropriate to the solder alloy in use. Apply gentle pressure and limit contact time to reduce the risk of lifting pads or damaging nearby components. Consider applying a small amount of flux when removing stubborn solder to improve wetting and absorption.