Kapton adhesive tape BLOW 15 mm x 33 m is a polyimide electrical insulating tape designed for high-temperature and chemically resistant applications in electronics and electrical engineering. The tape features a thin, flexible polyimide film with a pressure-sensitive adhesive that provides reliable dielectric insulation and dimensional stability across a wide temperature range. It is suitable for tasks such as PCB protection during soldering, masking for wave soldering, insulating coil windings and transformers, and general electronics assembly where temperature resistance and electrical isolation are required.
Advantages
The polyimide film delivers high thermal stability and excellent dielectric strength while remaining thin and conformable to irregular surfaces. The adhesive ensures secure bonding to metal, ceramic, and plastic substrates without leaving significant residue when removed under recommended conditions. The tape's chemical resistance and dimensional stability minimize deformation during thermal cycling, making it suitable for repeated exposure to soldering temperatures and other high-heat processes.
Suitable for
- Masking of printed circuit boards during wave and reflow soldering
- Insulation of transformers, coils and motor windings
- Protection of delicate components from heat and flux
- High-temperature splicing, repair and assembly in electronics
Key specifications
- Material: polyimide (Kapton) film
- Adhesive type: pressure-sensitive adhesive for electronic applications
- Width: 15 mm
- Length: 33 m
- Temperature resistance: suitable for high-temperature soldering processes (wave/reflow)
- Electrical properties: high dielectric strength and good insulating performance
- Chemical resistance: resistant to fluxes and many solvents used in electronics
- Physical characteristics: thin, flexible, conformable film
How to use
Clean and dry the surface before application to ensure optimal adhesion. Cut the required length and apply the tape smoothly over the area to be insulated or masked, pressing firmly to remove air pockets and ensure edge adhesion. For masking during soldering, cover the component or PCB area completely and verify that edges are well sealed to prevent flux ingress. After cooling, remove the tape carefully at a low angle to minimize adhesive transfer; if residue is present, use a compatible solvent recommended for electronics cleaning.
Usage recommendations
Store the tape in a cool, dry place away from direct sunlight and keep it in original packaging until use. For best performance in high-temperature processes, perform a small test on a sample component to confirm adhesion and residue behaviour under your specific process conditions.
