Desoldering pump Cimco 150300

The Cimco 150300 desoldering pump is a hand-operated tool designed to remove molten solder from through-hole components and pad connections on printed circuit boards. Measuring approximately 210 mm in length and finished in red for easy identification, this single-piece pump offers a simple suction mechanism suitable for repair, prototyping and maintenance work. It is compatible with Cimco soldering stations and intended to assist with rapid solder removal while maintaining access and visibility on small electronic assemblies.

Advantages

The Cimco desoldering pump features a compact, single-piece design that provides consistent suction and straightforward operation. Its 210 mm length gives good reach for most standard PCB layouts while the bright red finish improves visibility in a crowded toolbox. The pump’s mechanical action requires no external power, making it portable and usable anywhere without additional equipment. Designed for compatibility with Cimco soldering equipment, it integrates into bench workflows for routine desoldering tasks.

Suitable for

• Removing solder from through-hole components on PCB assemblies
• Rework and repair of electronic devices and hobby electronics
• Component replacement during prototyping and small-series production
• Maintenance tasks where a portable, manual desoldering tool is preferred

Key specifications

• Overall length: approximately 210 mm
• Construction: single-piece manual pump
• Operation: mechanical suction (hand-operated)
• Color: red for high visibility
• Compatibility: intended for use with Cimco soldering stations and standard through-hole PCB work

How to use

Heat the solder joint with a compatible soldering iron until the solder becomes molten. Position the tip of the desoldering pump directly over the molten solder and operate the pump according to its mechanical action (compress and release or trigger, depending on model) to draw the liquid solder into the chamber. After suction, inspect the pad and lead; repeat heating and suction if residual solder remains. Empty and clean the pump chamber as required to maintain suction performance and avoid clogging.

Usage recommendations

Use appropriate personal protective equipment such as safety glasses and work in a well-ventilated area. Match the soldering iron tip size and temperature to the component and PCB to avoid damage; avoid prolonged heating of pads. Regularly clean the pump chamber and replace worn tips or seals to ensure continued effective desoldering performance.