Solder Wire CYNEL Cyna 0.38 mm, 100 g, Sn60Pb40 alloy

CYNEL Cyna solder wire with a 0.38 mm diameter and 100 g spool is a leaded tin–lead alloy formulated for through-hole and general electronics soldering where Sn60Pb40 composition is required. The product provides a predictable melting range and consistent flow that facilitate manual soldering, component rework and small assembly operations. It is intended for use on common electronic metals and printed circuit boards where traditional leaded solder is specified.

Advantages

This solder wire offers stable melting behavior and reliable wetting on copper, tinned surfaces and other common electronic metals. The 0.38 mm diameter balances ease of feed and precision for small joints, while the 100 g spool provides a compact supply for repair benches and light production. The Sn60Pb40 alloy provides a familiar working profile for technicians accustomed to leaded solders, supporting good mechanical strength and solderability in standard electronic assemblies.

Suitable for

• Through-hole soldering of resistors, capacitors, connectors and other axial/ radial components
• Manual soldering and touch-up work on printed circuit boards
• Rework, repair and prototyping of electronic assemblies
• Small batch assembly where controlled solder feed and fine-diameter wire are needed

Key specifications

• Alloy composition: tin–lead Sn60Pb40
• Wire diameter: 0.38 mm
• Spool weight: 100 g
• Flux core: internally cored (suitable for electronics; check flux type on packaging)
• Application temperature: melts within the characteristic range for Sn60Pb40 alloys

How to use

Prepare the workpiece by cleaning the component leads and PCB pads from oxides, dirt and old solder residues. Heat the joint with an appropriate soldering iron tip sized for the component and allow the pad and lead to reach soldering temperature. Apply the CYNEL Cyna solder wire to the heated joint and let the solder flow to form a smooth fillet; withdraw heat and solder wire once the fillet forms. For rework, use suitable desoldering tools and observe proper thermal profiles to avoid board delamination or component damage.

Usage recommendations

Use adequate ventilation or local extraction when soldering with leaded alloys. Follow local regulations for use and disposal of lead-containing materials, and employ appropriate personal protective equipment such as eye protection and gloves when required.