CYNEL Sn60Pb40 SW26 solder wire is a 0.70 mm diameter, 250 g flux-cored spool intended for manual and bench electronics soldering where a leaded Sn60Pb40 alloy is required. The wire combines 60% tin and 40% lead in a consistent composition suitable for general-purpose through-hole assembly, component repair, and some surface-mount rework when a leaded solder is appropriate. The SW26 flux core simplifies wetting and joint formation during standard temperature soldering operations.
Advantages
The flux-cored formulation improves solder flow and reduces oxidation during heating, producing reliable joints on copper pads, component leads and wires. The 0.70 mm diameter offers a balance between precise application and reasonable deposition rate for hand soldering, while the 250 g spool provides extended use without frequent reloads. The Sn60Pb40 alloy has a lower melting range than lead-free alternatives, which can reduce thermal stress on heat-sensitive components during rework.
Suitable for
- Through-hole PCB assembly and component replacement
- General electronics repair and maintenance
- Soldering wires, connectors and terminals
- Manual desk-top soldering and prototyping
Key specifications
- Alloy composition: 60% tin (Sn), 40% lead (Pb)
- Flux type: SW26 flux-cored
- Diameter: 0.70 mm
- Spool net weight: 250 g
- Intended melting characteristics suitable for standard leaded soldering temperatures
How to use
Prepare work surfaces and ensure adequate ventilation due to lead-containing alloy fumes. Heat the soldering iron to the appropriate temperature for Sn60Pb40 solder, typically in the standard leaded soldering range. Clean pads and leads of oxidation, then apply heat and introduce the solder wire to the heated joint until sufficient solder flows to form a smooth fillet. Withdraw the solder and iron, allowing the joint to cool without disturbance. Store the spool in a dry place and avoid contamination of the flux core.
Usage recommendations
Use appropriate personal protective equipment and follow local regulations for handling and disposal of lead-containing materials. For applications subject to RoHS or other lead-free mandates, select a compliant solder alloy. For best results on small SMD pads, consider using flux, solder wick, or a finer diameter wire when tighter control of solder volume is required.
