Solder Tin Wire 0.70 mm, 500 g, Sn60Pb40 alloy, CYNEL

Solder tin wire 0.70 mm, 500 g spool from CYNEL is a lead-containing solder alloy composed of Sn60Pb40 designed for manual soldering in electronics and electrical assembly. The 0.70 mm diameter wire on a 500 g spool offers a balance between bulk and control, suitable for through-hole soldering, repair work and general-purpose joining of copper and common circuit materials. Its composition provides reliable wetting and predictable flow characteristics for routine rework, component replacement and prototyping tasks where a traditional leaded alloy is required.

Advantages

The Sn60Pb40 composition delivers a combination of lower melting range and good mechanical strength after solidification, promoting consistent joint formation and ease of use with standard soldering irons. The 0.70 mm diameter ensures controlled solder delivery for medium-fine work without frequent wire handling, while the 500 g spool reduces the need for frequent replacement in workshop environments. The product is suitable for manual soldering applications and offers dependable wetting on copper pads and component leads.

Suitable for

• Through-hole component soldering and assembly
• Electronic repairs and rework of printed circuit boards
• Prototyping and hobby electronics where leaded solder is acceptable
• General-purpose joining of copper wires, terminals and connectors

Key specifications

• Alloy composition: tin-lead alloy with approximately 60% tin and 40% lead
• Wire diameter: 0.70 mm
• Spool weight: 500 g
• Form: solid rod/wire on spool for manual dispensing
• Typical use temperature range: suitable for typical soldering iron temperatures for Sn–Pb solders

How to use

Prepare work surfaces and components by ensuring pads, leads and wires are clean and free from oxidation or contaminants. Heat the joint with a compatible soldering iron until the base metal reaches the appropriate temperature, then apply the solder wire to the heated joint allowing the solder to flow and wet the surfaces. Withdraw heat once a smooth, concave fillet is formed and allow the joint to cool undisturbed. Use appropriate flux if flux-cored wire is not specified or for difficult-to-wet surfaces, and follow standard ESD and safety procedures when working on electronic assemblies.

Usage recommendations

Use adequate ventilation and personal protective equipment when soldering with lead-containing alloys; follow local regulations for handling and disposal of leaded solder and flux residues. For fine-pitch surface-mount work consider using a finer diameter solder or appropriate soldering techniques; for large joints, increase heat and ensure sufficient solder flow to avoid cold joints.