Solder Tin Wire CYNEL 0.50 mm, 250 g Sn60Pb40 (leaded) for electronics soldering

Solder Tin Wire CYNEL 0.50 mm, 250 g Sn60Pb40 (leaded) for electronics soldering is a leaded alloy solder wire designed for manual and small rework applications in electronics assembly and repair. The Sn60Pb40 composition offers a predictable melting range and wetting behavior suitable for through-hole and surface-mount soldering when leaded solder is acceptable. The 0.50 mm diameter provides a balance between control and flow for typical component-level soldering tasks, and the 250 g spool offers a moderate quantity for repeated use in workshops and service benches.

Advantages

The Sn60Pb40 solder alloy delivers stable melting characteristics and reliable joint formation on common PCB finishes and component leads. A 0.50 mm diameter enables precise solder delivery for both small pads and larger joints without excessive solder application. The 250 g spool format is convenient for manual soldering workflows and reduces the need for frequent reel changes during repair or prototyping work.

Suitable for

• Hand soldering with a soldering iron on through-hole components
• Rework and repair of electronic assemblies
• Soldering of surface-mount components in small reflow or touch-up operations
• Prototyping and low-volume assembly in hobbyist and service environments

Key specifications

• Alloy composition: tin-lead alloy with approximately 60% tin and 40% lead
• Wire diameter: 0.50 mm
• Net spool weight: 250 g
• Form: solid wire on a spool for manual dispensing
• Typical use: manual soldering and small rework applications for electronic assemblies

How to use

Prepare the workpiece by cleaning PCB pads and component leads to remove oxidation, grease, or flux residues. Heat the joint with an appropriate soldering iron temperature for Sn60Pb40 alloy, apply the solder wire to the heated joint so the alloy melts and flows, then remove heat and allow the joint to cool to form a shiny, smooth connection. Use suitable flux when necessary to improve wetting and remove oxides. Store the spool in a dry environment to prevent contamination and to maintain consistent solderability.

Usage recommendations

Use leaded solder only where permitted by regulations and when acceptable for the product application. Employ local ventilation or fume extraction and appropriate personal protective equipment when soldering. Match iron temperature and tip size to component sensitivity and PCB construction to avoid thermal damage.