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Solder wire CYNEL SN60PB40 with flux core 1 mm 100 g, tin-lead alloy SN60PB40
CYNEL SN60PB40 is a flux‑core solder wire made from a tin‑lead alloy (60% Sn, 40% Pb) supplied on a 100 g spool with a 1 mm diameter. It is formulated for manual soldering and rework of electronic components and general electrical joints, providing the wetting behaviour and mechanical strength typical for Sn–Pb compositions. The product is intended for use where a traditional lead‑containing solder is acceptable and where reliable, easy flow and predictable joint formation are required.
The CYNEL SN60PB40 solder wire combines easy wetting with stable mechanical properties, enabling consistent solder joints on printed circuit boards and wire connections. The integrated flux core simplifies application by eliminating the need to apply separate flux for many manual soldering tasks. Its 1 mm diameter balances between heat transfer and accessibility for both component-level work and general repairs.
This solder contains lead and therefore is not appropriate for applications that require lead‑free materials, such as certain medical devices, food‑contact equipment, or electronics subject to RoHS restrictions. It may also be unsuitable where very fine pitch SMD work demands solder wire thinner than 1 mm or where a specifically formulated flux is required for particular surface finishes.
Secure the workpiece and heat the joint with an appropriately powered soldering iron or station set to a temperature suitable for Sn–Pb alloys (commonly 320–380 °C depending on tip size and thermal mass). apply heat to the parts to be joined rather than to the solder wire itself, then feed the solder wire into the heated joint so molten solder flows and wets the surfaces. Allow the joint to cool undisturbed to form a reliable connection. Clean flux residues if necessary using a suitable solvent or cleaning agent when required for the application.
Use suitable personal protective equipment and adequate ventilation when soldering with lead‑containing materials. Select a soldering iron tip that provides sufficient heat transfer for the joint size, and consider cleaning flux residues on sensitive assemblies to prevent long‑term corrosion or conductivity issues.
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