Solder wire CYNEL SN60PB40 with flux core 1 mm 100 g, tin-lead alloy SN60PB40

CYNEL SN60PB40 is a flux‑core solder wire made from a tin‑lead alloy (60% Sn, 40% Pb) supplied on a 100 g spool with a 1 mm diameter. It is formulated for manual soldering and rework of electronic components and general electrical joints, providing the wetting behaviour and mechanical strength typical for Sn–Pb compositions. The product is intended for use where a traditional lead‑containing solder is acceptable and where reliable, easy flow and predictable joint formation are required.

Advantages

The CYNEL SN60PB40 solder wire combines easy wetting with stable mechanical properties, enabling consistent solder joints on printed circuit boards and wire connections. The integrated flux core simplifies application by eliminating the need to apply separate flux for many manual soldering tasks. Its 1 mm diameter balances between heat transfer and accessibility for both component-level work and general repairs.

Suitable for

• Manual through-hole and small SMD rework on PCBs
• Repairing and rejoining wires and connectors in electrical assemblies
• Hobby electronics, prototyping and model electronics
• General maintenance tasks requiring traditional Sn–Pb solder

When it may not be suitable

This solder contains lead and therefore is not appropriate for applications that require lead‑free materials, such as certain medical devices, food‑contact equipment, or electronics subject to RoHS restrictions. It may also be unsuitable where very fine pitch SMD work demands solder wire thinner than 1 mm or where a specifically formulated flux is required for particular surface finishes.

Key specifications

• Alloy composition: tin‑lead (approximately 60% tin, 40% lead)
• Flux: core flux included (flux type: activated rosin-based flux — typical for general electronics use)
• Wire diameter: 1 mm
• Spool net weight: 100 g
• Typical applications: manual soldering, rework, general electrical joints

How to use

Secure the workpiece and heat the joint with an appropriately powered soldering iron or station set to a temperature suitable for Sn–Pb alloys (commonly 320–380 °C depending on tip size and thermal mass). apply heat to the parts to be joined rather than to the solder wire itself, then feed the solder wire into the heated joint so molten solder flows and wets the surfaces. Allow the joint to cool undisturbed to form a reliable connection. Clean flux residues if necessary using a suitable solvent or cleaning agent when required for the application.

What to consider before purchase

• Contains lead — confirm acceptability for your project and compliance with local regulations
• Wire diameter 1 mm — ensure this thickness suits your component sizes and soldering method
• Flux core type — verify compatibility with component plate finishes and whether post‑cleaning is needed

Usage recommendations

Use suitable personal protective equipment and adequate ventilation when soldering with lead‑containing materials. Select a soldering iron tip that provides sufficient heat transfer for the joint size, and consider cleaning flux residues on sensitive assemblies to prevent long‑term corrosion or conductivity issues.