Soldering Flux CYNA LUTOWNICZA LC-60 Sn60Pb40 Expert+ reverse load

CYNA LUTOWNICZA LC-60 Sn60Pb40 by Expert+ is a flux formulated for soldering with 60% tin / 40% lead alloys. Designed to assist wetting and improve solder flow, this flux helps achieve consistent solder joints during manual soldering and rework operations. The product is provided in a reverse load format intended for controlled dispensing and application during localized soldering tasks.

Advantages

The flux promotes reliable wetting on metals commonly used in electronic assemblies and reduces surface oxides to support proper solder adhesion. Its composition is matched to Sn60Pb40 solder, enabling improved solder joint formation and reduced defects such as cold joints or poor fillets. The reverse load presentation facilitates precise application and minimizes excess flux on the workpiece.

Suitable for

• Manual through-hole soldering with Sn60Pb40 solder alloy
• Small-scale rework and repair of circuit boards using leaded solder
• Localized soldering tasks where controlled flux delivery is required
• Soldering of components on electronic assemblies with metals prone to oxidation

Key specifications

• Flux type: formulated for use with 60% tin / 40% lead solder
• Application format: reverse load for controlled dispensing
• Intended use: manual soldering and rework
• Compatibility: suitable for common electronic metals and alloys used with Sn60Pb40

How to use

Prepare the work area and clean component leads and PCB pads of gross contamination. Apply a small amount of flux from the reverse load container to the solder joint area before heating. Heat the joint with an appropriately sized soldering iron and apply Sn60Pb40 solder until the fillet forms and the joint is fully wetted. After soldering, allow the joint to cool naturally and remove any residual flux if required by the assembly’s cleaning standards.

Usage recommendations

Use adequate ventilation when soldering with leaded alloys and follow local regulations for handling and disposal of lead-containing materials. Wear suitable personal protective equipment and avoid excessive flux application; a thin, even layer is typically sufficient for effective wetting and solder flow.