Thermal pad Gelid TP-GP01-D 80×40×2 mm, density 2.8 g/cm³

Gelid TP-GP01-D is a pre-formed thermal pad sized 80 × 40 × 2 mm, engineered to improve heat transfer between electronic components and heatsinks. With a material density of 2.8 g/cm³, this single-pad solution fills gaps and compensates for height differences and uneven surfaces on PCBs, improving thermal contact for components such as memory ICs, MOSFETs, VRM and chipset areas. The material is soft and conforms to irregular surfaces without curing, providing stable contact over assemblies like graphics cards, laptops and compact electronics.

Advantages

The thermal pad offers high conformability to fill micro-gaps and maintain continuous contact between components and cooling solutions. It is non-electrically conductive and non-corrosive, which reduces the risk of short circuits or substrate damage during installation. The pad does not cure, preserving its softness and thermal interface properties over time, and its single-piece format simplifies application on larger PCB areas. Suitable thickness and density ensure a balance between mechanical compliance and thermal transfer efficiency.

Suitable for

• Thermal bridging between PCBs and heatsinks on graphics cards
• Contact cushioning and heat transfer for VRM and chipset modules
• Cooling small PC modules, memory ICs and SMD components
• Thermal interface in laptops, game consoles and compact electronics

Key specifications

• Dimensions: 80 × 40 × 2 mm
• Material density: 2.8 g/cm³
• Form: single pre-cut pad
• Electrical behavior: non-electrically conductive
• Curing behavior: non-curing, remains soft

How to use

Clean both contact surfaces from dust, grease and old thermal interface material before installation. Cut the pad to the required shape if necessary, remove protective liners and place the pad directly onto the component or heatsink surface ensuring full coverage of the area to be cooled. Reassemble the device and secure the heatsink so that moderate pressure establishes continuous contact; re-check alignment after initial mounting. There is no curing time required and the pad functions immediately once compressed between the two surfaces.

Usage recommendations

Use the pad where mechanical compliance and insulation are required; avoid placement across exposed conductive traces if excessive compression could cause contact with neighbouring components. For best results, match pad thickness and area to the gap to avoid over-compression or insufficient contact. Store unused pads in a dry environment away from direct sunlight.