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Thermal pad Gelid TP-GP01-D 80×40×2 mm, density 2.8 g/cm³
Summary description:
Gelid TP-GP01-D is a thermal pad designed for heat transfer between components and heatsinks. Dimensions are 80 × 40 × 2 mm with a material density of 2.8 g/cm³. Supplied as a single pad, it fills gaps and improves thermal contact for cooling electronic components, small PC modules, VRM or chipset areas.