Thermal pad Gelid TP-GP01-S-B 120x120x1 mm, density 2.8 g/cm³, 1 pc

Gelid TP-GP01-S-B is a thermal pad designed to create an efficient thermal interface between electronic components and heatsinks. The sheet measures 120×120×1 mm and has a material density of 2.8 g/cm³. Supplied as a single pad per pack, it is intended to fill small gaps and compensate for uneven surfaces on PCBs, GPUs, CPUs, VRMs and other SMD components where a thin, non-liquid thermal interface is required.

Advantages

The thermal pad provides high thermal conductivity in a soft, conformable material that adapts to height differences and surface irregularities. It is non-electrically conductive, non-corrosive, non-curing and non-toxic, which simplifies handling and reduces the risk of electrical short circuits or material degradation. The enlarged 120×120 mm size covers extra-large PCB areas and densely populated boards, enabling easier alignment and fewer pieces required for broad heatsink contact.

Suitable for

• Thermal interface between heatsinks and GPUs or laptop graphics modules
• Gap filling on PCBs with memory ICs, MOSFETs and analog ICs
• Cooling contact on VRMs and power regulation components
• Thermal coupling in gaming consoles and compact electronics with uneven surfaces

Key specifications

• Dimensions: 120 × 120 × 1 mm
• Material density: 2.8 g/cm³
• Form: single sheet / 1 piece per pack
• Electrical property: non-electrically conductive
• Chemical/physical characteristics: non-corrosive, non-curing, non-toxic
• Intended use: gap-filling thermal interface for SMD components and heatsinks

How to use

Clean and dry the contact surfaces before application to remove dust, grease or residues. Measure and, if necessary, cut the Gelid thermal pad to fit the target area while keeping the thickness uniform. Peel off any protective liners and place the pad onto the component or heatsink, ensuring full contact without trapping large air pockets. Apply the heatsink and secure according to the device manufacturer’s instructions to establish consistent pressure and optimal thermal contact.

Usage recommendations

Use the pad on components where a thin, non-liquid interface is required and where surface irregularities or small height differences exist. Avoid stretching the pad and avoid contact with exposed electrical connectors. Replace the pad if it becomes compressed or damaged during maintenance to maintain thermal performance.