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Thermal pad Gelid TP-GP01-S-B 120x120x1 mm, density 2.8 g/cm³, 1 pc
Summary description:
Gelid TP-GP01-S-B is a thermal pad designed for heat transfer between components and heatsinks. Dimensions are 120 × 120 × 1 mm with a material density of 2.8 g/cm³. Supplied as a single sheet per pack, it provides a gap-filling interface for CPUs, GPUs, VRMs, or other electronic components where a thin, non-liquid thermal interface is required.