Thermal pad Gelid TP-GP01-S-E 120×120×3 mm, density 2.8 g/cm³, 1 pc

Gelid TP-GP01-S-E is a thermal pad sized 120×120×3 mm with a material density of 2.8 g/cm³, supplied as one pad per pack. It is engineered to improve thermal contact between electronic components and heatsinks by filling gaps and compensating for height differences and uneven surfaces on PCBs. The pad is soft and highly thermally conductive while being non-electrically conductive, non-corrosive, non-curing and non-toxic, making it suitable for a wide range of heat-transfer applications in computers and other electronic devices.

Advantages

The Gelid thermal pad offers high thermal conductivity and a soft, conforming texture that fills irregularities between components and heatsinks for improved heat transfer. Its enlarged 120×120 mm size covers extra-large PCB areas, reducing the need for multiple pads. The material is non-electrically conductive and non-corrosive, eliminating risk of short circuits or chemical damage. Being non-curing and non-toxic ensures stable performance over time and simpler handling during installation.

Suitable for

• Thermal interface between heatsinks and PCBs on GPUs, CPUs and chipset areas
• Gap filling for power modules, MOSFETs and other SMD components
• Thermal management in laptops, gaming consoles and compact electronics
• Heat dissipation for LED assemblies and power electronics

Key specifications

• Dimensions: 120 × 120 × 3 mm
• Material density: 2.8 g/cm³
• Quantity: 1 piece per pack
• Electrical properties: non-electrically conductive
• Chemical and physical behavior: non-corrosive, non-curing, non-toxic
• Form: soft, conforming thermal pad for gap filling

How to use

Prepare the contact surfaces by cleaning them of dust, grease and old thermal interface material. Measure and cut the Gelid thermal pad to the required shape if needed, then remove any protective liners and place the pad directly onto the component or heatsink contact area so it covers the intended surface. Apply the heatsink or clamp the assembly to ensure even pressure and proper contact; the pad will conform to surface irregularities and fill gaps. If disassembly is required later, peel the pad off carefully to avoid residue on components.

Usage recommendations

For best thermal performance, ensure surfaces are clean and the pad fully covers the contact area without excessive compression. Use the enlarged 120×120 mm size on large PCBs or cut to fit smaller areas. Avoid using the pad where direct electrical contact is required; despite being non-conductive, it is intended solely for thermal conduction. Store the pad in a dry environment and avoid prolonged exposure to high humidity or chemical solvents.