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Thermal pad Gelid TP-GP01-S-E 120×120×3 mm, density 2.8 g/cm³, 1 pc
Summary description:
Gelid TP-GP01-S-E is a thermal pad designed for heat transfer between components and heatsinks. It measures 120 × 120 × 3 mm with a material density of 2.8 g/cm³ and is supplied as one pad per pack. Use it to improve thermal contact on PC components, power modules, LED assemblies and other electronics requiring gap filling and effective thermal conduction.