Thermal pad Gelid TP-GP01-S-D — 120×120×2 mm, density 2.8 g/cm³, 1 pc

Gelid TP-GP01-S-D is a thermal pad sized 120×120×2 mm designed to improve heat transfer between electronic components and heatsinks. With a material density of 2.8 g/cm³ and supplied as a single piece, this thermal interface material provides a compliant layer that fills gaps and compensates for uneven surfaces on PCBs and densely packed assemblies. The pad is suitable for applications where consistent contact and reliable thermal conduction are required, including large GPU boards, laptop cooling systems and other electronics with varied component heights.

Advantages

The thermal pad offers high thermal conductivity and soft conformity to fill micro-gaps between components and heatsinks, which enhances overall cooling efficiency. Its enlarged 120×120 mm size covers extra-large PCB areas and simplifies alignment during installation. The material is non-electrically conductive, non-corrosive, non-curing and non-toxic, which reduces risk of electrical shorts and long-term material degradation while maintaining ease of handling.

Suitable for

• GPUs and large graphics cards requiring extended coverage
• Laptops and compact notebooks with dense component placement
• Gaming consoles and other consumer electronics with large PCB areas
• Power modules, MOSFETs, memory ICs and microcontroller units on PCBs

Key specifications

• Dimensions: 120 × 120 × 2 mm
• Material density: 2.8 g/cm³
• Quantity in pack: 1 piece
• Electrical characteristic: non-electrically conductive
• Chemical/physical properties: non-corrosive, non-curing, non-toxic

How to use

Clean both mating surfaces (component tops and heatsink contact area) from dust, grease and old thermal materials before application. Remove protective liners from the thermal pad and carefully place the pad onto the component side, aligning the pad to cover the intended areas. Press gently to ensure full contact and conform the pad to component heights; avoid stretching or tearing the material. Reassemble the cooling assembly and apply even mounting pressure so the pad fills gaps and establishes thermal contact.

Usage recommendations

Use the pad on dry, clean surfaces and avoid applying solvents or sharp tools that could damage the material. For best results, ensure even mounting pressure and verify clearance to avoid mechanical interference. Replace the pad if it shows signs of physical damage or contamination before reuse.