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Thermal pad Gelid TP-GP01-S-D — 120×120×2 mm, density 2.8 g/cm³, 1 pc
Summary description:
Gelid TP-GP01-S-D is a thermal pad designed for heat transfer between components and heatsinks. The pad measures 120×120×2 mm with a material density of 2.8 g/cm³ and is supplied as one piece per pack. It provides a compliant interface for filling gaps, improving thermal conduction in cooling assemblies for CPUs, GPUs, power modules and other electronic components.