Thermal Conductive Paste Gelid TP-GP03-C — thermal compound for CPUs and GPUs, generic tube

Gelid TP-GP03-C is a thermal conductive paste formulated to improve heat transfer between processors, graphics chips and their cooling solutions. Supplied in a convenient tube, this thermal compound is intended for use when installing or replacing CPU and GPU coolers and for thermal maintenance of small electronic components. The composition is designed to fill microscopic surface gaps and ensure consistent contact between a chip and a heatsink for more efficient cooling.

Advantages

The paste offers stable thermal conductivity suitable for desktop and laptop cooling tasks and is easy to apply from the tube without special tools. Its consistency allows for controlled spreading and reliable contact with most metal and composite heatsink surfaces. The non-curing formulation maintains performance over repeated mounting cycles and simplifies rework during component upgrades or maintenance.

Suitable for

• Applying thermal interface material between CPUs and aftermarket or stock coolers
• Replacing old thermal compound on GPUs and laptop processors
• Cooling small electronics such as chipsets, power regulators and compact boards

Key specifications

• Form: viscous thermal paste in a squeeze tube
• Intended use: thermal interface for CPUs, GPUs and other heat-generating components
• Application method: manual dispensing and spreading from tube
• Compatibility: suitable for contact with common heatsink materials (aluminium, copper, composite)
• Rework: allows multiple remounts without hard curing

How to use

Clean both the chip surface and the heatsink contact area with isopropyl alcohol and a lint-free cloth before applying the paste. Apply a small, pea-sized amount to the center of the processor or a thin, even line for elongated chips. Reattach the heatsink following the manufacturer’s mounting procedure and secure it evenly to spread the compound and eliminate air gaps. If needed, remove excess paste from the edges with a cloth and alcohol after mounting.

Usage recommendations

Use the thermal paste in a well-ventilated area and avoid contaminating contacts or sockets. For best thermal performance, apply a thin, even layer appropriate to the chip size; excessive amounts can reduce heat transfer efficiency. Store the tube capped and away from extreme temperatures to preserve consistency.