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Thermal Conductive Paste Gelid TP-GP03-C — thermal compound for CPUs and GPUs, generic tube
Summary description:
Gelid TP-GP03-C is a thermal conductive paste designed as a thermal interface material for CPUs, GPUs and other heat-generating components. supplied in a practical tube, it provides improved heat transfer between a chip and heatsink. Use for mounting or replacing thermal compound during CPU cooler installation, GPU maintenance, or small electronics cooling tasks.