Thermal pad Gelid TP-GP04-E, 90×50×3 mm, density 3.2 g/cm³, 1 pc

Gelid TP-GP04-E is a thermal pad engineered to improve heat transfer between electronic components and heatsinks. The pad measures 90 × 50 × 3 mm and has a material density of 3.2 g/cm³. Supplied as a single piece, it provides electrical insulation while filling gaps and uneven surfaces on PCBs, helping to reduce thermal resistance for CPUs, GPUs, VRMs, power modules and other assemblies.

Advantages

The Gelid TP-GP04-E combines a multilayer matrix and a material composition designed to conform to height differences and uneven surfaces. It is non-electrically conductive, non-corrosive, non-curing and non-toxic, and supports a wide operating temperature range. The pad’s dimensions and softness enable easy application on large PCB areas and densely packed components, improving contact between hot components and heatsinks without soldering or adhesives.

Suitable for

• Thermal bridging between chips (CPUs, GPUs) and heatsinks
• Cooling of VRMs, power MOSFETs and power modules
• Gap filling on motherboards, add-on cards and compact electronic assemblies
• Replacement or upgrade of worn or insufficient thermal interfaces

Key specifications

• Shape and size: 90 × 50 × 3 mm
• Material density: 3.2 g/cm³
• Quantity: 1 piece
• Electrical insulation: non-electrically conductive
• Chemical/physical properties: non-corrosive, non-curing, non-toxic
• Operating temperature range: -60°C to 220°C

How to use

Clean contact surfaces (component and heatsink) from dust, grease and old thermal material using an appropriate solvent and lint-free cloth. Measure and, if required, cut the Gelid TP-GP04-E pad to the correct size. Remove protective liners and place the pad onto the component or heatsink with gentle pressure, ensuring it covers the intended area and conforms to surface irregularities. Reassemble the device and tighten mechanical fasteners to the manufacturer’s recommended torque so the pad is compressed evenly for optimal thermal contact.

Usage recommendations

Use the Gelid TP-GP04-E where electrical insulation is required and when there are height differences or uneven surfaces between components and heatsinks. Avoid over-compressing beyond the recommended mechanical mounting specifications for your device. Store the pad in a cool, dry place away from direct sunlight and sharp objects to preserve its properties.