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Thermal pad Gelid TP-GP04-E, 90×50×3 mm, density 3.2 g/cm³, 1 pc
Summary description:
Gelid TP-GP04-E is a thermal pad designed for heat transfer between components and heatsinks. Dimensions are 90 × 50 × 3 mm with a material density of 3.2 g/cm³. Supplied as a single piece, it provides electrical insulation while filling gaps for improved thermal conductivity in CPUs, GPUs, VRMs, power modules and other electronic assemblies.