Thermal pad Gelid TP-GP04-S-D — 120×120×2 mm, density 3.2 g/cm³, 1 pc

Gelid TP-GP04-S-D is a thermal pad sized 120×120×2 mm and designed to provide a compliant thermal interface between electronic components and heatsinks. With a material density of 3.2 g/cm³ and supplied as a single pad, this thermal interface material fills gaps and compensates for uneven surfaces on PCB-mounted parts such as DRAM ICs, VRM circuits, power MOSFETs and M.2 type SSDs. The pad is non-electrically conductive, non-corrosive, non-curing and non-toxic, and it supports an extended operating temperature range from −60°C to 220°C.

Advantages

The thermal pad offers high thermal conductivity to improve heat transfer from components to heatsinks while maintaining electrical insulation. Its compliant structure conforms to height differences and irregular surfaces, reducing the need for precise mechanical tolerances. The material is stable across a wide temperature range and does not cure or corrode, which simplifies installation and long-term maintenance in dense electronic assemblies.

Suitable for

• DRAM ICs and RAM module surface coverage
• Voltage regulator modules (VRM) and power delivery circuits
• M.2 type SSDs and other compact storage modules
• Power MOSFETs, NVRAM ICs and similar high-temperature SMD components
• General gap filling between PCBs and heatsinks in desktops and servers

Key specifications

• Dimensions: 120 × 120 × 2 mm
• Material density: 3.2 g/cm³
• Thermal conduction: designed for high conductivity (product class performance)
• Electrical properties: non-electrically conductive
• Chemical and physical stability: non-corrosive, non-curing, non-toxic
• Operating temperature range: −60°C to 220°C
• Quantity: 1 piece

How to use

Measure and cut the thermal pad to the required shape and size if necessary, ensuring it covers the component and contact area on the heatsink without overlapping electrical traces. Clean both mating surfaces from dust, grease and old thermal materials before application. Remove protective liners and press the pad firmly into place to ensure full contact and gap filling; avoid stretching the material. Reassemble the device and apply the recommended mounting pressure to ensure consistent thermal contact across the pad.

Usage recommendations

For best results, use this thermal pad on components with modest gap heights where electrical insulation is required. Verify clearance and mechanical fit before final assembly, and avoid placing the pad across exposed solder joints or conductive traces. If cutting is required, use a sharp blade and clean edges to prevent debris; replace the pad if it becomes contaminated or damaged.